Telecom systems is the exchange of information over significant distances by electronic means. A complete, single telecommunications circuit consists of two stations, each equipped with a transmitter and a receiver. And we will offer the basic telecom products which you may familiar in your life to build up the telecom systems.
From Data center with a floor standing cabinets, you may get your sign out .For distribution outdoor, you may need a waterproof Distribution Box to exchange the singals. Meanwhile, you may have a terminal block with 10 pair disconnection Krone Module and lighting protectors(LSA single pair type or STB module). When you distribute in house, there are more products in application like voice patch panels, keystone jacks, face plate, 3M connectors(like UY connectors), AMP picapond connector, wall outlets, surface mount box, and so on. Sure there is a must to get the right tool to finish operations, kinds of tools for selection: Insertion tools, punch tool, crimping tool, wire cutter, cable stripper. Hot sale for krone insertion tool, RJ45 crimping tools, Ericsson punch down tool, AMP picabond ratechet crimper, Coaxial cable crimping tool .
We insist on compact size to ensure an easy but smart and reliable installation in every product of the telecom systems we offer. That is the final aim we work on solution, to make it perfect we also provide OEM service to satisfy your special demand. Till now, we have successfully take part in many Telecom projects in Russia, Sri Lanka, Greece, Ecuador, ect.. We have full experience in such tenders for building up telecom systems.
We keep on working just like the Cable Ring Managers to keep everything Orderly, Fast and Effective. Believe us and we will help you to be the winner !
Outdoor Distribution Box, LSA Krone Module, Mounting Frame, STB Module, Picabond Connector , Crimping Tool NINGBO YULIANG TELECOM MUNICATIONS EQUIPMENT CO.,LTD. , https://www.yltelecom.com
The era of eFPGA technology has come
For decades, embedded FPGA (eFPGA) technology has been present in various forms across the industry. To many, eFPGA is no longer a novel concept. However, in recent years, it has suddenly gained widespread attention. Why? This resurgence may be driven by two major economic trends converging within the semiconductor industry.
As device designs become increasingly complex, SoC development—encompassing software tools, engineering time, and mask costs—has grown more challenging. With each new generation of technology, development expenses have skyrocketed. Meanwhile, the per-unit cost of device functions has steadily declined. For instance, 20 or 30 years ago, FPGAs were costly. Integrating them into ASIC designs often increased the die size and complexity, making hybrid solutions too expensive for mass production. As a result, FPGAs were primarily used for prototyping rather than final products. That scenario is now outdated.
Today, SoC designs are both numerous and expensive, increasing the risk that no product will meet specific market demands. In contrast, FPGAs are cheaper and more flexible. By incorporating eFPGA into product design, companies can reduce market risks and boost economic returns.
One of the key advantages of eFPGA technology is its ability to address these economic challenges while offering additional benefits. When eFPGA IP is integrated into an SoC, the overall system achieves lower power consumption, reduced latency, and higher bandwidth compared to traditional ASIC + FPGA setups. eFPGA-enabled ASICs provide better performance, lower cost, smaller size, and maintain design flexibility.
The reprogrammable nature of eFPGA is particularly valuable. It allows engineers to update SoCs as market demands evolve, ensuring products remain relevant for longer and driving higher profitability. SoCs with eFPGA can quickly adapt to new standards, add features to counter emerging threats, and support multiple product variants—all while maximizing cost efficiency. The Internet of Things (IoT) is a prime example of this application.
Moreover, eFPGA technology helps reduce power consumption while improving performance. Certain SoC features may limit processor flexibility, but they can be optimized using FPGA logic, which offers higher performance and efficiency. The reconfigurable nature of eFPGA also enables engineers to create custom hardware solutions, further enhancing performance and reducing power usage.
In AI, IoT, and security applications, eFPGA brings significant value. In sensor processing, eFPGA in the EOS S3 SoC enables fast algorithm updates without requiring a new chip design. In AI-driven voice processing, eFPGA supports rapid integration of new triggers for smart speaker systems. The fragmented IoT market also benefits from eFPGA’s flexibility, allowing engineers to create multiple product variants without redesigning ASICs.
Machine learning can also benefit from eFPGA’s reconfigurability, enabling cost-effective solutions for complex problems. In security, eFPGA allows real-time updates to hardware-based security algorithms, providing timely defenses against evolving threats.
Looking ahead, eFPGA is set to grow as SoC teams adopt the technology more widely. While eFPGA faces challenges such as varying architectures and integration issues, the market is transitioning from early trials to mainstream adoption. eFPGA applications are becoming more common, spanning mobile devices, wearables, IoT, big data, communication systems, and cloud-based AI platforms.
Ultimately, eFPGA will succeed only if programmable logic is efficiently integrated into SoCs. When technology, architecture, and software tools align, development teams can create efficient design processes that turn ideas into market-ready products.