National investment ** Liu Cheng will invest in chip manufacturing

“Since the National IC Industrial Investment Fund was formally established in September 2014, it has raised more than 100 billion yuan in funds and hopes to shake trillions of funds into the IC industry in the future.” This is the general manager of the National Integrated Circuit Industry Investment Fund. Ding Wenwu revealed today at a signing ceremony for 25 integrated circuit industries in Hefei.

Ding Wenwu said that the fund company will implement market-oriented operation, commercialized management, and implement the "National Outline for the Development of the Integrated Circuit Industry," while ensuring the maximization of shareholders' interests. He pointed out that 60% of the National IC Industrial Investment Fund will be invested in integrated circuit chip manufacturing, and 40% will be invested in other IC-related fields such as design, packaging, and raw materials.

On January 12, 25 IC industry projects in Hefei were signed. Wu Churong, member of the Standing Committee of the Anhui Provincial Party Committee, Secretary of the Municipal Party Committee of Hefei City, Deputy Secretary of the Municipal Party Committee, Zhang Qingjun, Mayor of the Municipality, and Ding Wenwu, General Manager of the National Integrated Circuit Industry Investment Fund attended the signing ceremony.

According to reports, Hefei focused on signing up to 14 integrated circuit industry projects last year, this time there are 25 projects settled, a total investment of 13.8 billion yuan, of which 19 design projects, packaging and testing and specialty wafer manufacturing class 4 , materials and equipment category 2. Among the 25 contracted projects, there are one project with over 5 billion yuan, one project with more than one billion yuan, and 10 projects with more than 100 million yuan.

The signing project reflects the following characteristics: First, the industrial chain is complete and strong. The contracted projects cover aspects of integrated circuit design, manufacturing, packaging and testing, materials and equipment, etc., and can stimulate the development of electronic information industry and other strategic emerging industries. The second is the close integration of demand and high degree of market integration. Promoting dedicated, featured chip design, manufacturing, and packaging around new displays, smart home appliances, and automotive applications will help connect the entire application and chip design. The third is the high gold content, demonstrating a significant effect. The number of contracted projects is large and the scale is relatively large. There are many leading enterprises in the industry, and the agglomeration effect is significant.

Zhang Qingjun stated that Hefei will adhere to the principle of “application traction, innovation-driven, and characteristic development” and focus on the development of chip design, high-end packaging, and featured wafer manufacturing to develop cooperation with domestic and foreign leading enterprises to complement The integrated circuit industry chain is the focus of the implementation of design, manufacturing, packaging, testing and synchronization to accelerate the construction of a nationwide integrated circuit industry cluster. The centralized signing of the 25 integrated circuit industry projects will lay a solid foundation for achieving the set goals, and will play an important role in promoting Hefei's accelerated transformation and development, increase industrial competitiveness, and seize the future strategic development heights. According to reports, more than 80% of the 14 projects signed by Hefei last year have been registered and actually operated.

Ding Wenwu said that the integrated circuit industry is a strategic emerging industry of the national economy and is the driving force behind the rapid development of the information technology industry. Hefei attracted a large number of integrated circuit companies through internal lead outreach. Following the landing of 14 projects last year, 25 projects including integrated circuit design and packaging have also been settled this year. These projects are bound to promote The development of the IC industry in Hefei.